AQSH Federal Reserve yig‘ilishidagi bayonnomaga ko‘ra, bir nechta amaldorlar siyosat hali yetarlicha qat’iy emasligini ta’kidlashdi

AQSh Mudofaa vazirligi chip ishlab chiqaruvchi Wolfspeed (WOLF.US) kompaniyasiga AQSh ichida silisium karbid materiali va keng tarmoqli quvvat qurilmalari ishlab chiqarishni qo‘llab-quvvatlash uchun eng ko‘p 1.5 billion dollarlik, 30 yil muddatli shartli yuqori darajali kafolatli kredit ta’minoti taklif qildi. Hali muzokaralar qilinmagan shartnomaga ko‘ra, Wolfspeed Mudofaa vazirligiga optsion berib, unga kompaniya aksiyalarining 7.5% gacha bo‘lgan qismini bosqichma-bosqich sotib olish imkonini beradi. Wolfspeed o‘tgan yilning iyul oyida kalit silisium karbid plastinka fabrikasi ishlab chiqarish muammolari tufayli bankrotlikka ariza bergan edi; kompaniya bu mablag‘larni telekommunikatsiya, aerokosmik va mudofaa sohalari uchun silisium karbid materiallari va quvvat qurilmalarini ishlab chiqarishni kengaytirishga hamda harbiy aloqa tizimlari uchun tegishli materiallar yetkazib berish imkoniyatini yangilash uchun ishlatishini bildirdi. E’lon qilinishidan so‘ng, Wolfspeed kompaniyasining narxi savdo yakunidan keyin bir muddat 28% dan ko‘proqqa oshdi.

According to The Wall Street Journal: Insiders say Oracle is negotiating financing with institutions such as Apollo and Goldman Sachs to provide funds for a large-scale chip procurement, hoping to complete the deal as soon as this year. The financing aims to fill the gap between Oracle's payment for hardware purchases and the point when its cloud computing business starts generating revenue.

According to Wall Street Journal: Sources say Oracle (ORCL.US) is negotiating financing with institutions such as Apollo and Goldman Sachs to fund a large-scale chip procurement and hopes to complete the deal as early as this year. The financing aims to fill the funding gap between Oracle's payment for hardware purchases and the start of generating revenue from its cloud computing business.

Wall Street Journal’ning xabar berishicha, Broadcom (AVGO.US) so‘nggi haftalarda OpenAI bilan birga ishlab chiqilgan maxsus AI chiplarini ishlab chiqarish uchun 50 billions dollardan ortiq moliyalashtirish izlamoqda. Apollo va Blackstone kabi tashkilotlar moliyalashtirishda ishtirok etish bo‘yicha muzokaralar olib bormoqda, hozir muzokaralar dastlabki bosqichda va moliyalashtirish hajmi o‘zgarishi mumkin. Bu moliyalashtirish OpenAI’ning maxsus chiplarini ishlab chiqarish uchun bir necha gigavat quvvatni qamrab olishi mumkin va eng erta 2024 yil oxirigacha yakunlanishi kutilmoqda. OpenAI ichida bu chip loyihasi “Nexus” deb ataladi, birinchi va ikkinchi avlod chiplari mos ravishda “Jalapeño” va “Serrano” kod nomlariga ega. OpenAI va Broadcom ilgari 10 gigavat maxsus chip tizimini ishlab chiqish hamkorligini e’lon qilgan, bu tizim 2026 yilning ikkinchi yarmidan 2029 yil oxirigacha ketma-ket joylashtirilishi rejalashtirilgan.