AI Demand Drives Shift to Panel-Level Packaging, ACM Research Says

Bitget2026/10/29 16:56

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ACM Research's analysis identifies AI-driven demand for high-performance computing as a catalyst for panel-level packaging adoption amid packaging shortages.
TSMC's advanced packaging roadmap projects growth from 5.5 reticles today to 14 reticles by 2029, more than doubling package sizes.
Current round substrates accommodate about 30 to 35 packaged dies, limiting production capacity for increasingly large packages.
Square panels offer greater throughput, potentially higher yields and improved system performance through more effective chip integration.
Adoption faces equipment shortages, processes requiring optimization and a lack of standard panel sizes, complicating equipment makers' development priorities.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. ACM Research Inc. published the original content used to generate this news brief on October 29, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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AI Demand Drives Shift to Panel-Level Packaging, ACM Research Says

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